Axiom has been working with Ball Grid Arrays since 1995,
successfully meeting the challenge of processing each new
area array package style as it became available. Innovative
methods have been developed to solve unique problems
presented by new or unusual packaging designs. Regardless
of the service requested, our highly-skilled staff of engineers
and technicians can complete the most difficult assignments
in a precise and timely manner using state-of-the-art
techniques. Rework, repair, and modifications done in
our Prototype Precision Rework Laboratory meet the
stringent requirements of IPC-7711 and IPC-7721.
Axiom's rework capabilities include the removal, replacement,
and salvage of Ball Grid Arrays, Chip-scale Packages, and
microBGAs utilizing sophisticated equipment and techniques.
Our SRT Summit 1000/1100 rework systems and proprietary
re-balling processes can cope with today's exacting rework
challenges, and the quality of placements may be validated by
our CR Technology X-ray equipment.
Axiom's repair and modification capabilities include restoration
of pad patterns on circuit boards, the removal, addition, or
rerouting of circuitry, and replacement of solder balls on
Ball Grid Arrays. Repairs and modifications will meet design
specifications, and can be tested by our Test Department
using internally developed test programs and equipment.
Our capabilities include:
Please contact us with your questions about any of these
services. We look forward to adding you to our large and growing
list of satisfied customers.
