3DI Technology 
The next wave in circuit board design from Axiom
Axiom Electronics and its partner were recently awarded five patents for their revolutionary high-density packaging technology called 3DI. The process uses stacked, high-density substrates to create a very high density, 3-dimensional finished product with excellent cooling and electrical properties. Contact our sales department for more information. contact us.
Our 3DI technology offers:
• Hi interconnect
• High density
• Short line length for excellent electrical characteristics
• Reduction of conventional interconnect technologies
• Reduced PCB layer count
• Reduction in product size
• Good thermal characteristics
• Excellent mechanical strength
• Product differentiation through patented technology
Side View of Circuit Board
The next wave in circuit board design from Axiom
Axiom Electronics and its partner were recently awarded five patents for their revolutionary high-density packaging technology called 3DI. The process uses stacked, high-density substrates to create a very high density, 3-dimensional finished product with excellent cooling and electrical properties. Contact our sales department for more information. contact us.
Our 3DI technology offers:
• Hi interconnect
• High density
• Short line length for excellent electrical characteristics
• Reduction of conventional interconnect technologies
• Reduced PCB layer count
• Reduction in product size
• Good thermal characteristics
• Excellent mechanical strength
• Product differentiation through patented technology
Side View of Circuit Board
